Pulsed magnetic field ink jet printing mechanism

ABSTRACT

An ink jet nozzle arrangement includes a magnetic actuator that is located between a nozzle chamber and an ink supply reservoir and is actuated by externally supplied magnetic pulse cycles to eject ink. Each nozzle further includes a blocking mechanism for blocking movement of the magnetic actuator of those nozzles from which ink is not to be ejected during one of magnetic pulse cycles.

CROSS REFERENCES TO RELATED APPLICATIONS

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, US patent applications identified by their US patent application serial numbers (USSN) are listed alongside the Australian applications from which the US patent applications claim the right of priority.

US PATENT APPLICATION CROSS-REFERENCED (CLAIMING RIGHT OF AUSTRALIAN PRIORITY FROM PROVISIONAL AUSTRALIAN PRO- PATENT No. VISIONAL APPLICATION) DOCKET No. PO7991 09/113,060 ART01 PO8505 09/113,070 ART02 PO7988 09/113,073 ART03 PO9395 09/112,748 ART04 PO8017 09/112,747 ART06 PO8014 09/112,776 ART07 PO8025 09/112,750 ART08 PO8032 09/112,746 ART09 PO7999 09/112,743 ART10 PO7998 09/112,742 ART11 PO8031 09/112,741 ART12 PO8030 09/112,740 ART13 PO7997 09/112,739 ART15 PO7979 09/113,053 ART16 PO8015 09/112,738 ART17 PO7978 09/113,067 ART18 PO7982 09/113,063 ART19 PO7989 09/113,069 ART20 PO8019 09/112,744 ART21 PO7980 09/113,058 ART22 PO8018 09/112,777 ART24 PO7938 09/113,224 ART25 PO8016 09/112,804 ART26 PO8024 09/112,805 ART27 PO7940 09/113,072 ART28 PO7939 09/112,785 ART29 PO8501 09/112,797 ART30 PO8500 09/112,796 ART31 PO7987 09/113,071 ART32 PO8022 09/112,824 ART33 PO8497 09/113,090 ART34 PO8020 09/112,823 ART38 PO8023 09/113,222 ART39 PO8504 09/112,786 ART42 PO8000 09/113,051 ART43 PO7977 09/112,782 ART44 PO7934 09/113,056 ART45 PO7990 09/113,059 ART46 PO8499 09/113,091 ART47 PO8502 09/112,753 ART48 PO7981 09/113,055 ART50 PO7986 09/113,057 ART51 PO7983 09/113,054 ART52 PO8026 09/112,752 ART53 PO8027 09/112,759 ART54 PO8028 09/112,757 ART56 PO9394 09/112,758 ART57 PO9396 09/113,107 ART58 PO9397 09/112,829 ART59 PO9398 09/112,792 ART60 PO9399 09/112,791 ART61 PO9400 09/112,790 ART62 PO9401 09/112,789 ART63 PO9402 09/112,788 ART64 PO9403 09/112,795 ART65 PO9405 09/112,749 ART66 PP0959 09/112,784 ART68 PP1397 09/112,783 ART69 PP2370 09/112,781 DOT01 PP2371 09/113,052 DOT02 PO8003 09/112,834 Fluid01 PO8005 09/113,103 Fluid02 PO9404 09/113,101 Fluid03 PO8066 09/112,751 IJ01 PO8072 09/112,787 IJ02 PO8040 09/112,802 IJ03 PO8071 09/112,803 IJ04 PO8047 09/113,097 IJ05 PO8035 09/113,099 IJ06 PO8044 09/113,084 IJ07 PO8063 09/113,066 IJ08 PO8057 09/112,778 IJ09 PO8056 09/112,779 IJ10 PO8069 09/113,077 IJ11 PO8049 09/113,061 IJ12 PO8036 09/112,818 IJ13 PO8048 09/112,816 IJ14 PO8070 09/112,772 IJ15 PO8067 09/112,819 IJ16 PO8001 09/112,815 IJ17 PO8038 09/113,096 IJ18 PO8033 09/113,068 IJ19 PO8002 09/113,095 IJ20 PO8068 09/112,808 IJ21 PO8062 09/112,809 IJ22 PO8034 09/112,780 IJ23 PO8039 09/113,083 IJ24 PO8041 09/113,121 IJ25 PO8004 09/113,122 IJ26 PO8037 09/112,793 IJ27 PO8043 09/112,794 IJ28 PO8042 09/113,128 IJ29 PO8064 09/113,127 IJ30 PO9389 09/112,756 IJ31 PO9391 09/112,755 IJ32 PP0888 09/112,754 IJ33 PP0891 09/112,811 IJ34 PP0890 09/112,812 IJ35 PP0873 09/112,813 IJ36 PP0993 09/112,814 IJ37 PP0890 09/112,764 IJ38 PP1398 09/112,765 IJ39 PP2592 09/112,767 IJ40 PP2593 09/112,768 IJ41 PP3991 09/112,807 IJ42 PP3987 09/112,806 IJ43 PP3985 09/112,820 IJ44 PP3983 09/112,821 IJ45 PO7935 09/112,822 IJM01 PO7936 09/112,825 IJM02 PO7937 09/112,826 IJM03 PO8061 09/112,827 IJM04 PO8054 09/112,828 IJM05 PO8065 09/113,111 IJM06 PO8055 09/113,108 IJM07 PO8053 09/113,109 IJM08 PO8078 09/113,123 IJM09 PO7933 09/113,114 IJM10 PO7950 09/113,115 IJM11 PO7949 09/113,129 IJM12 PO8060 09/113,124 IJM13 PO8059 09/113,125 IJM14 PO8073 09/113,126 IJM15 PO8076 09/113,119 IJM16 PO8075 09/113,120 IJM17 PO8079 09/113,221 IJM18 PO8050 09/113,116 IJM19 PO8052 09/113,118 IJM20 PO7948 09/113,117 IJM21 PO7951 09/113,113 IJM22 PO8074 09/113,130 IJM23 PO7941 09/113,110 IJM24 PO8077 09/113,112 IJM25 PO8058 09/113,087 IJM26 PO8051 09/113,074 IJM27 PO8045 09/113,089 IJM28 PO7952 09/113,088 IJM29 PO8046 09/112,771 IJM30 PO9390 09/112,769 IJM31 PO9392 09/112,770 IJM32 PP0889 09/112,798 IJM35 PP0887 09/112,801 IJM36 PP0882 09/112,800 IJM37 PP0874 09/112,799 IJM38 PP1396 09/113,098 IJM39 PP3989 09/112,833 IJM40 PP2591 09/112,832 IJM41 PP3990 09/112,831 IJM42 PP3986 09/112,830 IJM43 PP3984 09/112,836 IJM44 PP3982 09/112,835 IJM45 PP0895 09/113,102 IR01 PP0870 09/113,106 IR02 PP0869 09/113,105 IR04 PP0887 09/113,104 IR05 PP0885 09/112,810 IR06 PP0884 09/112,766 IR10 PP0886 09/113,085 IR12 PP0871 09/113,086 IR13 PP0876 09/113,094 IR14 PP0877 09/112,760 IR16 PP0878 09/112,773 IR17 PP0879 09/112,774 IR18 PP0883 09/112,775 IR19 PP0880 09/112,745 IR20 PP0881 09/113,092 IR21 PO8006 09/113,100 MEMS02 PO8007 09/113,093 MEMS03 PO8008 09/113,062 MEMS04 PO8010 09/113,064 MEMS05 PO8011 09/113,082 MEMS06 PO7947 09/113,081 MEMS07 PO7944 09/113,080 MEMS09 PO7946 09/113,079 MEMS10 PO9393 09/113,065 MEMS11 PP0875 09/113,078 MEMS12 PP0894 09/113,075 MEMS13

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The present invention relates to the ink jet printing and in particular discloses a pulsed magnetic field ink jet printer.

The present invention further relates to the field of the drop on demand ink jet printing.

BACKGROUND OF THE INVENTION

Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.

In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.

Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).

Ink Jet printers themselves come in many different types. The utilization of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.

U.S. Pat. No. 3,596,275 by Sweet also discloses a process of continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilised by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)

Piezoelectric inkjet printers are also one form of commonly utilised inkjet printing device. Piezoelectric systems are disclosed by Kyser et. al in U.S. Pat. No. 3,946,398 (1970) which utilises a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.

Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed disclose by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclose ink jet printing techniques that rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of the ink from an aperture connected to the confined space onto a relevant print media. Printing devices utilizing the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.

As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an alternative form of ink jet printing which relies upon a pulsed magnetic field to activate an ink jet actuator.

In accordance with the first aspect of the present invention there is provided a nozzle arrangment for an ink jet printhead comprising a nozzle chamber having an ink ejection port for the ejection of the ink from the nozzle chamber, an ink supply reservoir for supplying ink to the nozzle chamber and a magnetic actuator located between the nozzle chamber and the ink supply reservoir which is configured to be actuated to by externally supplied magnetic pulse cycles to eject ink from the ejection port.

Further, the nozzle arrangement comprises a part of an array of nozzle arrangements and each of the nozzles arrangement further comprises a blocking mechanism, for blocking movement of the magnetic actuator for those nozzles arrangements from which it is desired not to eject ink in a particular magnetic pulse cycle. Preferably the blocking mechanism comprises a thermal actuator having a moveable end portion which is moveable to a position blocking the path of movement of the magnetic actuator. The magnetic actuator can include and end protuberance designed to engage the blocking mechanism upon movement of the actuator. Advantageously the magnetic actuator is affixed to an adjacent wall of the nozzle chamber by means of two bendable strip portions which allow bending movement of the magnetic actuator upon activation by the externally supplied magnetic pulse cycles.

Further the thermal actuator can comprise substantially two arms affixed to a substrate, a first arm having a thin serpentine structure encased in a material having high coefficient of thermal expansion an a second arm comprising a thicker arm having a tapered thin portion near the end connecting to the substrate so as to concentrate any bending of the thermal actuator at a point close to the substrate. The blocking means can be located in a cavity having a low degree of fluid flow through the cavity and preferably, the serpentine arm of the thermal actuator is located alongside an inner wall of the cavity.

The ink jet nozzle is constructed via fabrication of a silicon wafer utilizing semi-conductor fabrication techniques. Advantageously, the actuators include a silicon nitride covering as required so as to insulate and passivate them from adjacent portions. Further the nozzle chambers can be formed from high density low pressure plasma etching of the silicon substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

FIG. 1 is a perspective, partly sectional view of a single nozzle arrangement for an ink jet printhead in its quiescent position constructed in accordance with the preferred embodiment;

FIG. 2 is a perspective, partly sectional view of the nozzle arrangement in its firing position constructed in accordance with the preferred embodiment;

FIG. 3 is an exploded perspective illustrating the construction of the nozzle arrangement in accordance with the preferred embodiment;

FIG. 4 provides a legend of the materials indicated in FIGS. 5 to 19; and

FIG. 5 to FIG. 19 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the preferred embodiment, an array of the nozzle arrangements is provided with each of the nozzles being under the influence of a outside pulsed magnetic field. The outside pulsed magnetic field causes selected nozzle arrangements to eject ink from their ink nozzle chambers.

Turning initally to FIG. 1 and FIG. 2, there is illustrated a side perspective view, partly in section, of a single ink jet nozzle arrangement 10. FIG. 1 illustrates the nozzle arrangement 10 in a quiescent position and FIG. 2 illustrates the nozzle arrangement 10 in an ink ejection position. The nozzle arrangement 10 has an ink ejection port 11 for the ejection of ink on demand. The ink ejection port 11 is connected to an ink nozzle chamber 12 which is usually filled with ink and supplied from an ink reservoir 13 via holes eg. 15.

A magnetic actuation device 25 is included and comprises a magnetic soft core 17 which is surrounded by a nitride coating eg. 18. The nitride coating 18 includes an end protuberance 27.

The magnetic core 17, operates under the influence of an external pulsed magnetic field. Hence, when the external magnetic field is very high, the actuator 25 is caused to move rapidly downwards and to thereby cause the ejection of ink from the ink ejection port 11. Adjacent the actuator 25 is provided a blocking mechanism 20 which comprises a thermal actuator which includes a copper resistive circuit having two arms 22, 24. A current is passed through the connected arms 22, 24 thereby causing them to be heated. The arm 22, being of a thinner construction undergoes more resistive heating than the arm 24 which has a much thicker structure. The arm 22 is also of a serpentine nature and is encased in polytetrafluoroethylene (PTFE) which has a high coefficient of thermal expansion, thereby increasing the degree of expansion upon heating. The copper portions expand with the PTFE portions by means of a concertina-like movement. The arm 24 has a thinned portion 29 (FIG. 3) which becomes the concentrated bending region in the resolution of the various forces activated upon heating. Hence, any bending of the arm 24 is accentuated in the portion 29 and upon heating, the region 29 bends so that end portion 26 (FIG. 3) moves out to block any downward movement of the edge 27 of the actuator 25. Hence, when it is desired to eject an ink drop from a particular nozzle chamber 12, the blocking mechanism 20 is not activated and as a result ink is ejected from the ink ejection port 11 during the next external magnetic pulse phase. When the nozzle arrangement 10 is not to eject ink, the locking mechanism 20 is activated to block any movement of the actuator 25 and therefore stop the ejection of ink from the port 11. Movement of the blocking mechanism is indicated at 21 in FIG. 3.

Importantly, the actuator 20 is located within a cavity 28 such that the volume of ink flowing past the arm 22 is extremely low whereas the arm 24 receives a much larger volume of ink flow during operation.

Turning now to FIG. 3, there is illustrated an exploded perspective view of a single nozzle arrangement 10 illustrating the various layers which make up the nozzle arrangement 10. The nozzle arrangement 10 can be constructed on a semiconductor wafer utilizing standard semiconductor processing techniques in addition to those techniques commonly used for the construction of micro-electromechanical systems (MEMS). For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceedings of the SPIE (International Society for Optical Engineering), volumes 2642 and 2882 which contain the proceedings for recent advances and conferences in this field. At the bottom level 30 is constructed a nozzle plate 30 including the ink ejection port 11. The nozzle plate 30 can be constructed from a buried boron doped epitaxial layer of a silicon wafer which has been back etched to the point of the epitaxial layer. The epitaxial layer itself is then etched utilizing a mask so as to form a nozzle rim 31 and the ejection port 11.

Next, the silicon wafer layer 32 is etched to define the nozzle chamber 12. The silicon layer 32 is etched to contain substantially vertical side walls by using high density, low pressure plasma etching such as that available from Surface Technology Systems and subsequently filled with sacrificial material which is later etched away.

On top of the silicon layer 32 is deposited a two level CMOS circuitry layer 33 which comprises substantially glass in addition to the usual metal and poly layers. A layer 33 includes the formation of the heater element contacts which can be constructed from copper. The PTFE layer 35 can be provided as a departure from normal construction with a bottom PTFE layer being first deposited followed by a copper layer 34 and a second PTFE layer to cover the copper layer 34.

Next, a nitride passivation layer 36 is provided which acts to provide a passivation surface for the lower layers in addition to providing a base for a soft magnetic Nickel Ferrous layer 17 which forms the magnetic actuator portion of the actuator 25. The nitride layer 36 includes bending portions 40 utilized in the bending of the actuator.

Next a nitride paasivation layer 39 is provided so as to passivate the top and side surfaces of the nickel iron (NiFe) layer 17.

One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:

1. Using a double sided polished wafer 50 deposit 3 microns of epitaxial silicon heavily doped with boron 30.

2. Deposit 10 microns of epitaxal silicon 32 either p-type or n-type, depending upon the CMOS process used.

3. Complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process 33. Relevant features of the wafer at this step are shown in FIG. 5. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 4 is a key to representations of various materials in these maufacturing diagrams, and those of other cross referenced ink jet configurations.

4. Etch the CMOS oxide layers down to silicon or aluminum using Mask 1. This mask defines the nozzle chamber, and the edges of the print head chips. This step is shown in FIG. 6.

5. Crystallographically etch the exposed silicon using, for example, KOH or EDP (ethylenediamine pyrocatechol). This etch stops on <111> crystallographic planes 51, and on the boron doped silicon buried layer. This step is shown in FIG. 7.

6. Deposit 0.5 microns of silicon nitride (Si₃N₄) 52.

7. Deposit 10 microns of sacrificial material 53. Planarize down to one micron over nitride using CMP. The sacrificial material temporarily fills th nozzle cavity. This step is shown in FIG. 8.

8. Deposit 0.5 microns of polytetrafluoroethylene (PTFE) 54.

9. Etch contact vias in the PTFE, the sacraficial material, nitride, and CMOS oxide layers down to second level metal using Mask 2. This step is shown in FIG. 9.

10. Deposit 1 micron of titanium nitride (TiN) 55.

11. Etch the TiN using Mask 3. This mask defines the heater pattern for the hot arm of the catch actuator, the cold arm of the catch actuator, and the catch. This step is shown in FIG. 10.

12. Deposit 1 micron of PTFE 56.

13. Etch both layers of PTFE using Mask 4. This mask defines the sleeve of the hot arm of the catch actuator. This step is shown in FIG. 11.

14. Deposit a seed layer for electroplating.

15. Spin on 11 microns of resist 57, and expose and develop the resist using Mask 5. This mask defines the magnetic paddle. This step in shown in FIG. 12.

16. Electroplate 10 microns of ferromagnetic material 58 such as nickel iron (NiFe). This step is shown in FIG. 13.

17. Strip the resist and etch the seed layer.

18. Deposit 0.5 microns of low stress PECVD silicon nitride 59.

19. Etch the nitride using Mask 6, which defines the spring. This step is shown in FIG. 14.

20. Mount the wafer on a glass blank 60 and back-etch the wafer using KOH with no mask.

This etch thins the wafer and stops at the buried boron doped silicon layer. This step is shown in FIG. 15.

21. Plasma back-etch the boron doped silicon layer to a depth of 1 micron using Mask 7. This mask defines the nozzle rim 31. This step is shown in FIG. 16.

22. Plasma back-etch through the boron doped layer using Mask 8. This mask defines the nozzle 11, and the edge of the chips.

23. Plasma back-etch nitride up to the glass sacrificial layer through the holes in the boron doped silicon layer. At this stage, the chips are separate , but are still mounted on the glass blank. This step is shown in FIG. 17.

24. Strip the adhesive layer to detach the chips from the glass blank.

25. Etch the sacrificial layer. This step is shown in FIG. 18.

26. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply different colors of ink to the appropriate regions of the front surface of the wafer.

27. Connect the printheads to their interconnect systems.

28. Hydrophobize the front surface to the printheads.

29. Fill the completed print heads with ink 61, apply an oscillating magnetic field, and test the printheads. This step is shown in FIG. 19.

It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the preferred embodiment without departing from the spirit or scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.

The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: colour monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers, high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers large format plotters, photograph copiers, printers for digital photographic ‘minilabs’, video printers, PHOTO CD (PHOTO CD is a registered trademark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads printheads with 19,200 nozzles.

Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:

low power (less than 10 Watts)

high resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table under the heading Cross References to Related Applications.

The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.

For ease of manufacture using standard process equipment, the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.

Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.

Tables of Drop-on-Demand Ink Jets

Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of ink jet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. These are designated IJ01 to IJ45 above which matches the docket numbers in the tables under the heading Cross References to Related Applications.

Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into ink jet print heads with characteristics superior to any currently available ink jet technology.

Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, print technology may be listed more than once in a table, where it shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) Description Advantages Disadvantages Examples Thermal An electrothermal ♦ Large force ♦ High power ♦ Canon Bubblejet bubble heater heats the ink to generated ♦ Ink carrier 1979 Endo et al GB above boiling point, ♦ Simple limited to water patent 2,007,162 transferring significant construction ♦ Low efficiency ♦ Xerox heater-in- heat to the aqueous ♦ No moving parts ♦ High temperatures pit 1990 Hawkins et al ink. A bubble ♦ Fast operation required U.S. Pat. No. 4,899,181 nucleates and quickly ♦ Small chip area ♦ High mechanical ♦ Hewlett-Packard forms, expelling the required for actuator stress TIJ 1982 Vaught et al ink. ♦ Unusual materials U.S. Pat. No. 4,490,728 The efficiency of the required process is low, with ♦ Large drive transistors typically less than ♦ Cavitation causes 0.05% of the electrical actuator failure energy being ♦ Kogation reduces transformed into bubble formation kinetic energy of the ♦ Large print heads drop. are difficult to fabricate Piezo- A piezoelectric crystal ♦ Low power ♦ Very large area ♦ Kyser et al U.S. electric such as lead consumption required for actuator Pat No. 3,946,398 lanthanum zirconate ♦ Many ink types ♦ Difficult to ♦ Zoltan U.S. Pat. No. (PZJ) is electrically can be used integrate with 3,683,212 activated, and either ♦ Fast operation electronics ♦ 1973 Stemme expands, shears, or ♦ High efficiency ♦ High voltage drive U.S. Pat. No. 3,747,120 bends to apply transistors required ♦ Epson Stylus pressure to the ink, ♦ Full pagewidth ♦ Tektronix ejecting drops. print heads impractical ♦ IJ04 due to actuator size ♦ Requires electrical poling in high field strengths during manufacture Electro- An electric field is ♦ Low power ♦ Low maximum strain ♦ Seiko Epson, strictive used to activate consumption strain (approx. 0.01%) Usui et al JP electrostriction in ♦ Many ink types ♦ Large area required 253401/96 relaxor materials such can be used for actuator due to ♦ IJ04 as lead lanthanum ♦ Low thermal low strain zirconate titanate expansion ♦ Response speed is (PLZT) or lead ♦ Electric field marginal (˜10 μs) magnesium niobate strength required ♦ High voltage drive (PMN). (approx. 3.5 V/μm) transistors required can be generated ♦ Full pagewidth without difficulty printheads impractical ♦ Does not require due to actuator size electrical poling Ferro- An electric field is ♦ Low power ♦ Difficult to ♦ IJ04 electric used to induce a phase consumption integrate with transition between the ♦ Many ink types electronics antiferroelectric (AFE) can be used ♦ Unusual materials and ferroelectric (FE) ♦ Fast operation such as PLZSnT are phase. Perovskite (<1 μs) required materials such as tin ♦ Relatively high ♦ Actuators require a modified lead longitudinal strain large area lanthanum zirconate ♦ High efficiency titanate PLZSnT) ♦ Electric field exhibit large strains of strength of around 3 up to 1% associated V/μm can be readily with the AFE to FE provided phase transition. Electro- Conductive plates are ♦ Low power ♦ Difficult to ♦ IJ02, IJ04 static plates separated by a consumption operate electrostatic compressible or fluid ♦ Many ink types devices in an dielectric (usually air). can be used aqueous environment Upon application of a ♦ Fast operation ♦ The electrostatic voltage, the plates actuator will normally attract each other and need to be separated displace ink, causing from the ink drop ejection. The ♦ Very large area conductive plates may required to achieve be in a comb or high forces honeycomb structure, ♦ High voltage drive or stacked to increase transistors may be the surface area and required therefore the force. ♦ Full pagewidth print heads are not competitive due to actuator size Electro- A strong electric field ♦ Low current ♦ High voltage ♦ 1989 Saito et al, static pull is applied to the ink, consumption required U.S. Pat. No. 4,799,068 on ink whereupon ♦ Low temperature ♦ May be damaged ♦ 1989 Miura et al, electrostatic attraction by sparks due to air U.S. Pat. No. 4,810,954 accelerates the ink breakdown ♦ Tone-jet towards the print ♦ Required field medium. strength increases as the drop size decreases ♦ High voltage drive transistors required ♦ Electrostatic field attracts dust Permanent An electromagnet ♦ Low power ♦ Complex ♦ IJ07, IJ10 magnet directly attracts a consumption fabrication electro- permanent magnet, ♦ Many ink types ♦ Permanent magnetic displacing ink and can be used magnetic material causing drop ejection. ♦ Fast operation such as Neodymium Rare earth magnets ♦ High efficiency Iron Boron (NdFeB) with a field strength ♦ Easy extension required. around 1 Tesla can be from single nozzles ♦ High local used. Examples are: to pagewidth print currents required Samarium Cobalt heads ♦ Copper metalization (SaCo) and magnetic should be used for materials in the long electromigration neodymium iron boron lifetime and low family (NdFeB, resistivity NdDyFeBNb, ♦ Pigmented inks NdDyFeB, etc) are usually infeasible ♦ Operating temperature limited to the Curie temperature (around 540 K.) Soft A solenoid induced a ♦ Low power ♦ Complex ♦ IJ01, IJ05, IJ08, IJ10, magnetic magnetic field in a soft consumption fabrication IJ12, IJ14, IJ15, IJ17 core electro- magnetic core or yoke ♦ Many ink types ♦ Materials not magnetic fabricated from a can be used usually present in a ferrous material such ♦ Fast operation CMOS fab such as as electroplated iron ♦ High efficiency NiFe, CoNiFe, or alloys such as CoNiFe ♦ Easy extension CoFe are required [1], CoFe, or NiFe from single nozzles ♦ High local alloys. Typically, the to pagewidth print currents required soft magnetic material heads ♦ Copper metalization is in two parts, which should be used for are normally held long electromigration apart by a spring. lifetime and low When the solenoid is resistivity actuated, the two parts ♦ Electroplating is attract, displacing the required ink. ♦ High saturation flux density is required (2.0-2.1 T is achiev- able with CoNiFe [1]) Lorenz The Lorenz force ♦ Low power ♦ Force acts as a ♦ IJ06, IJ11, IJ13, IJ16 force acting on a current consumption twisting motion carrying wire in a ♦ Many ink types ♦ Typically, only a magnetic field is can be used quarter of the solenoid utilized. ♦ Fast operation length provides force This allows the ♦ High efficiency in a useful direction magnetic field to be ♦ Easy extension ♦ High local currents supplied externally to from single nozzles required the print head, for to pagewidth print ♦ Copper metalization example with rare heads should be used for earth permanent long electromigration magnets. lifetime and low Only the current resistivity carrying wire need be ♦ Pigmented inks fabricated on the print- are usually infeasible head, simplifying materials requirements. Magneto- The actuator uses the ♦ Many ink types ♦ Force acts as a ♦ Fischenbeck, striction giant magnetostrictive can be used twisting motion U.S. Pat. No. 4,032,929 effect of materials ♦ Fast operation ♦ Unusual ♦ IJ25 such as Terfenol-D (an ♦ Easy extension materials such as alloy of terbium, from single nozzles Terfenol-D are dysprosium and iron to pagewidth print required developed at the Naval heads ♦ High local Ordnance Laboratory, ♦ High force is currents required hence Ter-Fe-NOL). available ♦ Copper For best efficiency, the metalization should actuator should be pre- be used for long stressed to approx. 8 electromigration MPa. lifetime and low resistivity ♦ Pre-stressing may be reguired Surface Ink under positive ♦ Low power ♦ Requires ♦ Silverbrook, EP tension pressure is held in a consumption supplementary force 0771 658 A2 and reduction nozzle by surface ♦ Simple to effect drop related patent tension. The surface construction separation applications tension of the ink is ♦ No unusual ♦ Requires special reduced below the materials required in ink surfactants bubble threshold, fabrication ♦ Speed may be causing the ink to ♦ High efficiency limited by surfactant egress from the ♦ Easy extension properties nozzle. from single nozzles to pagewidth print heads Viscosity The ink viscosity is ♦ Simple ♦ Requires ♦ Silverbrook, EP reduction locally reduced to construction supplementary force 0771 658 A2 and select which drops are ♦ No unusual to effect drop related patent to be ejected. A materials required in separation applications viscosity reduction can fabrication ♦ Requires special be achieved ♦ Easy extension ink viscosity electrothermally with from single nozzles properties most inks, but special to pagewidth print ♦ High speed is inks can be engineered heads difficult to achieve for a 100:1 viscosity ♦ Requires reduction. oscillating ink pressure ♦ A high temperature difference (typically 80 degrees) is required Acoustic An acoustic wave is ♦ Can operate ♦ Complex drive ♦ 1993 Hadimioglu generated and without a nozzle circuitry et al, EUP 550,192 focussed upon the plate ♦ Complex ♦ 1993 Elrod et al, drop ejection region. fabrication EUP 572,220 ♦ Low efficiency ♦ Poor control of drop position ♦ Poor control of drop volume Thermo- An actuator which ♦ Low power ♦ Efficient aqueous ♦ IJ03, IJ09, IJ17, IJ18, elastic bend relies upon differential consumption operation requires a IJ19, IJ20, IJ21, IJ22, actuator thermal expansion ♦ Many ink types thermal insulator on IJ23, IJ24, IJ27, IJ28, upon Joule heating is can be used the hot side IJ29, IJ30, IJ31, IJ32, used. ♦ Simple planar ♦ Corrosion IJ33, IJ34, IJ35, IJ36, fabrication prevention can be IJ37, IJ38 ,IJ39, IJ40, ♦ Small chip area difficult IJ41 required for each ♦ Pigmented inks actuator may be infeasible, ♦ Fast operation as pigment particles ♦ High efficiency may jam the bend ♦ CMOS actuator compatible voltages and currents ♦ Standard MEMS processes can be used ♦ Easy extension from single nozzles to pagewidth print heads High CTE A material with a very ♦ High force can ♦ Requires special ♦ IJ09, IJ17, IJ18, IJ20, thermo- high coefficient of be generated material (e.g. PTFE) IJ21, IJ22, IJ23, IJ24, elastic thermal expansion ♦ Three methods of ♦ Requires a PTFE IJ27, IJ28, IJ29, IJ30, actuator (CTE) such as PTFE deposition are deposition process, IJ31, IJ42, IJ43, IJ44 polytetrafluoroethylene under development: which is not yet (PTFE) is used. As chemical vapor standard in ULSI high CTE materials deposition (CVD), fabs are usually non- spin coating, and ♦ PTFE deposition conductive, a heater evaporation cannot be followed fabricated from a ♦ PTFE is a with high conductive material is candidate for low temperature (above incorporated. A 50 μm dielectric constant 350° C.) processing long PTFE bend insulation in ULSI ♦ Pigmented inks actuator with ♦ Very low power may be infeasible, polysilicon heater and consumption as pigment particles 15 mW power input ♦ Many ink types may jam the bend can provide 180 μN can be used actuator force and 10 μm ♦ Simple planar deflection. Actuator fabrication motions include: ♦ Small chip area Bend required for each Push actuator Buckle ♦ Fast operation Rotate ♦ High efficiency ♦ CMOS compatible voltages and currents ♦ Easy extension from single nozzles to pagewidth print heads Conductive A polymer with a high ♦ High force can ♦ Requires special ♦ IJ24 polymer coefficient of thermal be generated materials thermo- expansion (such as ♦ Very low power development (High elastic PTFE) is doped with consumption CTE conductive actuator conducting substances ♦ Many ink types polymer) to increase its can be used ♦ Requires a PTFE conductivity to about 3 ♦ Simple planar deposition process, orders of magnitude fabrication which is not yet below that of copper. ♦ Small chip area standard in ULSI The conducting required for each fabs polymer expands actuator ♦ PTFE deposition when resistively ♦ Fast operation cannot be followed heated. ♦ High efficiency with high Examples of ♦ CMOS temperature (above conducting dopants compatible voltages 350° C.) processing include: and currents ♦ Evaporation and Carbon nanotubes ♦ Easy extension CVD deposition Metal fibers from single nozzles techniques cannot Conductive polymers to pagewidth print be used such as doped heads ♦ Pigmented inks polythiophene may be infeasible, Carbon granules as pigment particles may jam the bend actuator Shape A shape memory alloy ♦ High force is ♦ Fatigue limits ♦ IJ26 memory such as TiNi (also available (stresses maximum number alloy known as Nitinol - of hundreds of MPa) of cycles Nickel Titanium alloy ♦ Large strain is ♦ Low strain (1%) developed at the Naval available (more than is required to extend Ordnance Laboratory) 3%) fatigue resistance is thermally switched ♦ High corrosion ♦ Cycle rate between its weak resistance limited by heat martensitic state and ♦ Simple removal its high stiffness construction ♦ Requires unusual austenic state. The ♦ Easy extension materials (TiNi) shape of the actuator from single nozzles ♦ The latent heat of in its martensitic state to pagewidth print transformation must is deformed relative to heads be provided the austenic shape. ♦ Low voltage ♦ High current The shape change operation operation causes ejection of a ♦ Requires pre- drop. stressing to distort the martensitic state Linear Linear magnetic ♦ Linear Magnetic ♦ Requires unusual ♦ IJ12 Magnetic actuators include the actuators can be semiconductor Actuator Linear Induction constructed with materials such as Actuator (LIA), Linear high thrust, long soft magnetic alloys Permanent Magnet travel, and high (e.g. CoNiFe) Synchronous Actuator efficiency using ♦ Some varieties (LPMSA), Linear planar also require Reluctance semiconductor permanent magnetic Synchronous Actuator fabrication materials such as (LRSA), Linear techniques Neodymium iron Switched Reluctance ♦ Long actuator boron (NdFeB) Actuator (LSRA), and travel is available ♦ Requires the Linear Stepper ♦ Medium force is complex multi- Actuator (LSA). available phase drive circuitry ♦ Low voltage ♦ High current operation operation

BASIC OPERATION MODE Description Advantages Disadvantages Examples Actuator This is the simplest ♦ Simple operation ♦ Drop repetition ♦ Thermal ink jet directly mode of operation: the ♦ No external rate is usually ♦ Piezoelectric ink pushes ink actuator directly fields required limited to around 10 jet supplies sufficient ♦ Satellite drops kHz. However, this ♦ IJ01, IJ02, IJ03, kinetic energy to expel can be avoided if is not fundamental IJ04, IJ05, IJ06, the drop. The drop drop velocity is less to the method, IJ07, IJ09, IJ11, must have a sufficient than 4 m/s but is related IJ12, IJ14, IJ16, velocity to overcome ♦ Can be efficient, to the refill method IJ20, IJ22, IJ23, the surface tension. depending upon the normally used IJ24, IJ25, IJ26, actuator used ♦ All of the drop IJ27, IJ28, IJ29, kinetic energy must IJ30, IJ31, IJ32, be provided by the IJ33, IJ34, IJ35, actuator IJ36, IJ37, IJ38, ♦ Satellite drops IJ39, IJ40, IJ41, usually form if drop IJ42, IJ43, IJ44 velocity is greater than 4.5 m/s Proximity The drops to be ♦ Very simple print ♦ Requires close ♦ Silverbrook, EP printed are selected by head fabrication can proximity between 0771 658 A2 and some manner (e.g. be used the print head and related patent thermally induced ♦ The drop the print media or applications surface tension selection means transfer roller reduction of does not need to ♦ May require two pressurized ink). provide the energy print heads printing Selected drops are required to separate alternate rows of the separated from the ink the drop from the image in the nozzle by nozzle ♦ Monolithic color contact with the print print heads are medium or a transfer difficult roller. Electro- The drops to be ♦ Very simple print ♦ Requires very ♦ Silverbrook, EP static pull printed are selected by head fabrication can high electrostatic 0771 658 A2 and on ink some manner (e.g. be used field related patent thermally induced ♦ The drop ♦ Electrostatic field applications surface tension selection means for small nozzle ♦ Tone-Jet reduction of does not need to sizes is above air pressurized ink). provide the energy breakdown Selected drops are required to separate ♦ Electrostatic field separated from the ink the drop from the may attract dust in the nozzle by a nozzle strong electric field. Magnetic The drops to be ♦ Very simple print ♦ Requires ♦ Silverbrook, EP pull on ink printed are selected by head fabrication can magnetic ink 0771 658 A2 and some manner (e.g. be used ♦ Ink colors other related patent thermally induced ♦ The drop than black are applications surface tension selection means difficult reduction of does not need to ♦ Requires very pressurized ink). provide the energy high magnetic fields Selected drops are required to separate separated from the ink the drop from the in the nozzle by a nozzle strong magnetic field acting on the magnetic ink. Shutter The actuator moves a ♦ High speed (>50 ♦ Moving parts are ♦ IJ13, IJ17, IJ21 shutter to block ink kHz) operation can required flow to the nozzle. The be achieved due to ♦ Requires ink ink pressure is pulsed reduced refill time pressure modulator at a multiple of the ♦ Drop timing can ♦ Friction and wear drop ejection be very accurate must be considered frequency. ♦ The actuator ♦ Stiction is. energy can be very possible low Shuttered The actuator moves a ♦ Actuators with ♦ Moving parts are ♦ IJ08, IJ15, IJ18, grill shutter to block ink small travel can be required IJ19 flow through a grill to used ♦ Requires ink the nozzle. The shutter ♦ Actuators with pressure modulator movement need only small force can be ♦ Friction and wear be equal to the width used must be considered of the grill holes. ♦ High speed (>50 ♦ Stiction is kHz) operation can possible be achieved Pulsed A pulsed magnetic ♦ Extremely low ♦ Requires an ♦ IJ10 magnetic field attracts an ‘ink energy operation is external pulsed pull on ink pusher’ at the drop possible magnetic field pusher ejection frequency. An ♦ No heat ♦ Requires special actuator controls a dissipation materials for both catch, which prevents problems the actuator and the the ink pusher from ink pusher moving when a drop is ♦ Complex not to be ejected. construction

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description Advantages Disadvantages Examples None The actuator directly ♦ Simplicity of ♦ Drop ejection ♦ Most ink jets, fires the ink drop, and construction energy must be including piezoelectric there is no external ♦ Simplicity of supplied by and thermal bubble. field or other operation individual nozzle ♦ IJ01, IJ02, IJ03, IJ04, mechanism required. ♦ Small physical actuator IJ05, IJ07, IJ09, IJ11, size IJ12, IJ14, IJ20, IJ22, IJ23, IJ24, IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The ink pressure ♦ Oscillating ink ♦ Requires external ♦ Silverbrook, EP ink pressure oscillates, providing pressure can provide ink pressure 0771 658 A2 and (including much of the drop a refill pulse, oscillator related patent acoustic ejection energy. The allowing higher ♦ Ink pressure applications stimulation) actuator selects which operating speed phase and amplitude ♦ IJ08, IJ13, IJ15, IJ17, drops are to be fired ♦ The actuators must be carefully IJ18, IJ19, IJ21 by selectively may operate with controlled blocking or enabling much lower energy ♦ Acoustic nozzles. The ink ♦ Acoustic lenses reflections in the ink pressure oscillation can be used to focus chamber must be may be achieved by the sound on the designed for vibrating the print nozzles head, or preferably by an actuator in the ink supply. Media The print head is ♦ Low power ♦ Precision ♦ Silverbrook, EP proximity placed in close ♦ High accuracy assembly required 0771 658 A2 and proximity to the print ♦ Simple print head ♦ Paper fibers may related patent medium. Selected drops construction cause problems applications protrude from the print ♦ Cannot print on head further than un- rough substrates selected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation. Transfer Drops are printed to a ♦ High accuracy ♦ Bulky ♦ Silverbrook, EP roller transfer roller instead ♦ Wide range of ♦ Expensive 0771 658 A2 and of straight to the print print substrates can ♦ Complex related patent medium. A transfer be used construction applications roller can also be used ♦ Ink can be dried ♦ Tektronix hot melt for proximity drop on the transfer roller piezoelectric ink jet separation. ♦ Any of the IJ series Electro- An electric field is ♦ Low power ♦ Field strength ♦ Silverbrook, EP static used to accelerate ♦ Simple print head required for 0771 658 A2 and selected drops towards construction separation of small related patent the print medium. drops is near or applications above air ♦ Tone-Jet breakdown Direct A magnetic field is ♦ Low power ♦ Requires ♦ Silverbrook, EP magnetic used to accelerate ♦ Simple print head magnetic ink 0771 658 A2 and field selected drops of construction ♦ Requires strong related patent magnetic ink towards magnetic field applications the print medium. Cross The print head is ♦ Does not require ♦ Requires external ♦ IJ06, IJ16 magnetic placed in a constant magnetic materials magnet field magnetic field. The to be integrated in ♦ Current densities Lorenz force in a the print head may be high, current carrying wire manufacturing resulting in is used to move the process electromigration actuator. problems Pulsed A pulsed magnetic ♦ Very low power ♦ Complex print ♦ IJ10 magnetic field is used to operation is possible head construction field cyclically attract a ♦ Small print head ♦ Magnetic paddle, which pushes size materials required in on the ink. A small print head actuator moves a catch, which selectively prevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description Advantages Disadvantages Examples None No actuator mechanical ♦ Operational ♦ Many actuator ♦ Thermal Bubble amplification is used. simplicity mechanisms have Ink jet The actuator directly insufficient travel, or ♦ IJ01, IJ02, IJ06, drives the drop ejection insufficient force to IJ07, IJ16, IJ25, process. efficiently drive the IJ26 drop ejection process Differential An actuator material ♦ Provides greater ♦ High stresses are ♦ Piezoelectric expansion expands more on one travel in a reduced involved ♦ IJ03, IJ09, IJ17, bend side than on the other. print head area ♦ Care must be taken IJ18, IJ19, IJ20, actuator The expansion may be that the materials IJ21, IJ22, IJ23, thermal, piezoelectric, do not delaminate IJ24, IJ27, IJ29, magnetostrictive, or ♦ Residual bend IJ30, IJ31, IJ32, other mechanism. The resulting from high IJ33, IJ34, IJ35, bend actuator converts temperature or high IJ36, IJ37, IJ38, a high force low travel stress during formation IJ39, IJ42, IJ43, actuator mechanism to IJ44 high travel, lower force mechanism. Transient A trilayer bend actuator ♦ Very good ♦ High stresses are ♦ IJ40, IJ41 bend where the two outside temperature stability involved actuator layers are identical. ♦ High speed, as a ♦ Care must be taken This cancels bend due new drop can be that the materials to ambient temperature fired before heat do not delaminate and residual stress. The dissipates actuator only responds ♦ Cancels residual to transient heating stress of formation of one side to the other. Reverse The actuator loads a ♦ Better coupling ♦ Fabrication ♦ IJ05, IJ11 spring spring. When the to the ink complexity actuator is turned off, ♦ High stress in the the spring releases. spring This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. Actuator A series of thin ♦ Increased travel ♦ Increased ♦ Some stack actuators are stacked. ♦ Reduced drive fabrication piezoelectric ink jets This can be appropriate voltage complexity ♦ IJ04 where actuators require ♦ Increased high electric field possibility of short strength, such as circuits due to electrostatic and pinholes piezoelectric actuators. Multiple Multiple smaller ♦ Increases the ♦ Actuator forces ♦ IJ12, IJ13, IJ18, actuators actuators are used force available from may not add IJ20, IJ22, IJ28, simultaneously to an actuator linearly, reducing IJ42, IJ43 move the ink. Each ♦ Multiple efficiency actuator need provide actuators can be only a portion of the positioned to control force required. ink flow accurately Linear A linear spring is used ♦ Matches low ♦ Requires print ♦ IJ15 Spring to transform a motion travel actuator with head area for the with small travel and higher travel spring high force into a requirements longer travel, lower ♦ Non-contact force motion. method of motion transformation Coiled A bend actuator is ♦ Increases travel ♦ Generally ♦ IJ17, IJ21, IJ34, actuator coiled to provide ♦ Reduces chip restricted to planar IJ35 greater travel in a area implementations reduced chip area. ♦ Planar due to extreme implementations are fabrication difficulty relatively easy to in other orientations. fabricate. Flexure A bend actuator has a ♦ Simple means of ♦ Care must be ♦ IJ10, IJ19, IJ33 bend small region near the increasing travel of taken not to exceed actuator fixture point, which a bend actuator the elastic limit in flexes much more the flexure area readily than the ♦ Stress remainder of the distribution is very actuator. The actuator uneven flexing is effectively ♦ Difficult to converted from an even accurately model coiling to an angular with finite element bend, resulting in greater analysis travel of the actuator tip. Catch The actuator controls a ♦ Very low ♦ Complex ♦ IJ10 small catch. The catch actuator energy construction either enables or disables ♦ Very small ♦ Requires external movement of an ink actuator size force pusher that is controlled ♦ Unsuitable for in a bulk manner. pigmented inks Gears Gears can be used to ♦ Low force, low ♦ Moving parts are ♦ IJ13 increase travel at the travel actuators can required expense of duration. be used ♦ Several actuator Circular gears, rack ♦ Can be fabricated cycles are required and pinion, ratchets, using standard ♦ More complex and other gearing surface MEMS drive electronics methods can be used. processes ♦ Complex construction ♦ Friction, friction, and wear are possible Buckle plate A buckle plate can be ♦ Very fast ♦ Must stay within ♦ S. Hirata et al, used to change a slow movement elastic limits of the “An Ink-jet Head actuator into a fast achievable materials for long Using Diaphragm motion. It can also device life Microactuator”, convert a high force, ♦ High stresses Proc. IEEE MEMS, low travel actuator involved Feb. 1996, pp 418- into a high travel, ♦ Generally high 423. medium force motion. power requirement ♦ IJ18, IJ27 Tapered A tapered magnetic ♦ Linearizes the ♦ Complex ♦ IJ14 magnetic pole can increase magnetic construction pole travel at the expense force/distance curve of force. Lever A lever and fulcrum is ♦ Matches low ♦ High stress ♦ IJ32, IJ36, IJ37 used to transform a travel actuator with around the fulcrum motion with small higher travel travel and high force requirements into a motion with ♦ Fulcrum area has longer travel and no linear movement, lower force. The lever and can be used for can also reverse the a fluid seal direction of travel. Rotary The actuator is ♦ High mechanical ♦ Complex ♦ IJ28 impeller connected to a rotary advantage construction impeller. A small ♦ The ratio of force ♦ Unsuitable for angular deflection of to travel of the pigmented inks the actuator results in actuator can be a rotation of the matched to the impeller vanes, which nozzle requirements push the ink against by varying the stationary vanes and number of impeller out of the nozzle. vanes Acoustic A refractive or ♦ No moving parts ♦ Large area ♦ 1993 Hadimioglu lens diffractive (e.g. zone required et al, EUP 550,192 plate) acoustic lens is ♦ Only relevant for ♦ 1993 Elrod et al, used to concentrate acoustic ink jets EUP 572,220 sound waves. Sharp A sharp point is used ♦ Simple ♦ Difficult to ♦ Tone-jet conductive to concentrate an construction fabricate using point electrostatic field. standard VLSI processes for a surface ejecting ink- jet ♦ Only relevant for electrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume The volume of the ♦ Simple ♦ High energy is ♦ Hewlett-Packard expansion actuator changes, construction in the typically required to Thermal Ink jet pushing the ink in all case of thermal ink achieve volume ♦ Canon Bubblejet directions. jet expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations Linear, The actuator moves in ♦ Efficient ♦ High fabrication ♦ IJ01, IJ02, IJ04, IJ07, normal to a direction normal to coupling to ink complexity may be IJ11, IJ14 chip surface the print head surface. drops ejected required to achieve The nozzle is typically normal to the perpendicular in the line of movement. surface motion Parallel to The actuator moves ♦ Suitable for ♦ Fabrication ♦ IJ12, IJ13, IJ15, IJ33, chip surface parallel to the print planar fabrication complexity IJ34, IJ35, IJ36 head surface. Drop ♦ Friction ejection may still be ♦ Stiction normal to the surface. Membrane An actuator with a ♦ The effective ♦ Fabrication ♦ 1982 Howkins push high force but small area of the actuator complexity U.S. Pat. No. 4,459,601 area is used to push a becomes the ♦ Actuator size stiff membrane that is membrane area ♦ Difficulty of in contact with the ink. integration in a VLSI process Rotary The actuator causes ♦ Rotary levers ♦ Device complexity ♦ IJ05, IJ08, IJ13, IJ28 the rotation of some may be used to ♦ May have friction element, such a grill or increase travel at a pivot point impeller ♦ Small chip area requirements Bend The actuator bends ♦ A very small ♦ Requires the ♦ 1970 Kyser et al when energized. This change in actuator to be made U.S. Pat. No. 3,946,398 may be due to dimensions can be from at least two ♦ 1973 Stemme differential thermal converted to a large distinct layers, or to U.S. Pat No. 3,747,120 expansion, piezoelectric motion. have a thermal ♦ IJ03, IJ09, IJ10, IJ19, expansion, magneto- difference across the IJ23, IJ24, IJ25, IJ29, striction, or other actuator IJ30, IJ31, IJ33, IJ34, form of relative IJ35 dimensional change. Swivel The actuator swivels ♦ Allows operation ♦ Inefficient ♦ IJ06 around a central pivot. where the net linear coupling to the ink This motion is suitable force on the paddle motion where there are opposite is zero forces applied to ♦ Small chip area opposite sides of the requirements paddle, e.g. Lorenz force. Straighten The actuator is ♦ Can be used with ♦ Requires careful ♦ IJ26, IJ32 normally bent, and shape memory balance of stresses straightens when alloys where the to ensure that the energized. austenic phase quiescent bend is is planar accurate Double The actuator bends in ♦ One actuator can ♦ Difficult to make ♦ IJ36, IJ37, IJ38 bend one direction when be used to power the drops ejected by one element is two nozzles. both bend directions energized, and bends ♦ Reduced chip identical. the other way when size. ♦ A small another element is ♦ Not sensitive to efficiency loss energized. ambient temperature compared to equivalent single bend actuators. Shear Energizing the ♦ Can increase the ♦ Not readily ♦ 1985 Fishbeck actuator causes a shear effective travel of applicable to other U.S. Pat. No. 4,584,590 motion in the actuator piezoelectric actuator material. actuators mechanisms Radial con- The actuator squeezes ♦ Relatively easy ♦ High force ♦ 1970 Zoltan U.S. striction an ink reservoir, to fabricate single required Pat. No. 3,683,212 forcing ink from a nozzles from glass ♦ Inefficient constricted nozzle. tubing as macro- ♦ Difficult to scopic structures integrate with VLSI processes Coil/uncoil A coiled actuator ♦ Easy to fabricate ♦ Difficult to ♦ 1117, IJ21, 1134, IJ35 uncoils or coils more as a planar VLSI fabricate for non- tightly. The motion of process planar devices the free end of the ♦ Small area ♦ Poor out-of-plane actuator ejects the ink. required, therefore stiffness low cost Bow The actuator bows (or ♦ Can increase the ♦ Maximum travel ♦ IJ16, IJ18, IJ27 buckles) in the middle speed of travel is constrained when energized. ♦ Mechanically ♦ High force rigid required Push-Pull Two actuators control ♦ The structure is ♦ Not readily ♦ IJ18 a shutter. One actuator pinned at both ends, suitable for ink jets pulls the shutter, and so has a high out-of- which directly push the other pushes it. plane rigidity the ink Curl A set of actuators curl ♦ Good fluid flow ♦ Design ♦ IJ20, IJ42 inwards inwards to reduce the to the region behind complexity volume of ink that the actuator they enclose. increases efficiency Curl A set of actuators curl ♦ Relatively simple ♦ Relatively large ♦ IJ43 outwards outwards, pressurizing construction chip area ink in a chamber sur- rounding the actuators, and expelling ink from a nozzle in the chamber. Iris Multiple vanes enclose ♦ High efficiency ♦ High fabrication ♦ IJ22 a volume of ink. These ♦ Small chip area complexity simultaneously rotate, ♦ Not suitable for reducing the volume pigmented inks between the vanes. Acoustic The actuator vibrates ♦ The actuator can ♦ Large area ♦ 1993 Hadimioglu vibration at a high frequency. be physically distant required for et al, EUP 550,192 from the ink efficient operation ♦ 1993 Elrod et al, at useful frequencies EUP 572,220 ♦ Acoustic coupling and crosstalk ♦ Complex drive circuitry ♦ Poor control of drop volume and position None In various ink jet ♦ No moving parts ♦ Various other ♦ Silverbrook, EP designs the actuator tradeoffs are 077 1658 A2 and does not move. required to related patent eliminate moving applications parts ♦ Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages Examples Surface This is the normal way ♦ Fabrication ♦ Low speed ♦ Thermal ink jet tension that ink jets are simplicity ♦ Surface tension ♦ Piezoelectric ink refilled. After the ♦ Operational force relatively jet actuator is energized, simplicity small compared to ♦ IJ01-IJ07, IJ10- it typically returns actuator force IJ14, IJ16, IJ20, rapidly to its normal ♦ Long refill time IJ22-IJ45 position. This rapid usually dominates return sucks in air the total repetition through the nozzle rate opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. This force refills the nozzle. Shuttered Ink to the nozzle ♦ High speed ♦ Requires ♦ IJ08, IJ13, IJ15, oscillating chamber is provided at ♦ Low actuator common ink IJ17, IJ18, IJ19, ink pressure a pressure that energy, as the pressure oscillator IJ21 oscillates at twice the actuator need only ♦ May not be drop ejection frequency. open or close the suitable for When a drop is to be shutter, instead of pigmented inks ejected, the shutter is ejecting the ink drop opened for 3 half cycles: drop ejection, actuator return, and refill. The shutter is then closed to prevent the nozzle chamber emptying during the next negative pressure cycle. Refill After the main actuator ♦ High speed, as ♦ Requires two ♦ IJ09 actuator has ejected a drop a the nozzle is independent second (refill) actuator actively refilled actuators per nozzle is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. Positive ink The ink is held a slight ♦ High refill rate, ♦ Surface spill ♦ Silverbrook, EP pressure positive pressure. therefore a high must be prevented 0771 658 A2 and After the ink drop is drop repetition rate ♦ Highly related patent ejected, the nozzle is possible hydrophobic print applications chamber fills quickly head surfaces are ♦ Alternative for:, as surface tension and required IJ01-IJ07, IJ10-IJ14, ink pressure both operate IJ16, IJ20, IJ22-IJ45 to refill the nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description Advantages Disadvantages Examples Long inlet The ink inlet channel ♦ Design simplicity ♦ Restricts refill rate ♦ Thermal ink jet channel to the nozzle chamber ♦ Operational ♦ May result in a ♦ Piezoelectric ink is made long and simplicity relatively large chip jet relatively narrow, Reduces crosstalk area ♦ IJ42, IJ43 relying on viscous ♦ Only partially drag to reduce inlet effective back-flow. Positive ink The ink is under a ♦ Drop selection ♦ Requires a method ♦ Silverbrook, EP pressure positive pressure, so and separation (such as a nozzle 0771 658 A2 and that in the quiescent forces can be rim or effective related patent state some of the ink reduced hydrophobizing, or applications drop already protrudes ♦ Fast refill time both) to prevent ♦ Possible from the nozzle. flooding of the operation of the This reduces the ejection surface of following: IJ01- pressure in the nozzle the print head. IJ07, IJ09-IJ12, chamber which is IJ14, IJ16, IJ20, required to eject a IJ22, IJ23-IJ34, certain volume of ink. IJ36-IJ41, IJ44 The reduction in chamber pressure results in a reduction of ink pushed out through the inlet. Baffle One or more baffles ♦ The refill rate is ♦ Design ♦ HP Thermal Ink are placed in the inlet not as restricted as complexity Jet ink flow. When the the long inlet method. ♦ May increase ♦ Tektronix actuator is energized, ♦ Reduces crosstalk fabrication piezoelectric ink jet the rapid ink movement complexity (e.g. creates eddies which Tektronix hot melt which restrict the flow Piezoelectric print through the inlet. The heads). slower refill process is unrestricted, and does not result in eddies. Flexible flap In this method recently ♦ Significantly ♦ Not applicable to ♦ Canon restricts disclosed by Canon, reduces back-flow most ink jet inlet the expanding actuator for edge-shooter configurations (bubble) pushes on a thermal ink jet ♦ Increased fabrication flexible flap that devices complexity restricts the inlet. ♦ Inelastic deformation of polymer flap results in creep over extended use Inlet filter A filter is located ♦ Additional ♦ Restricts refill rate ♦ IJ04, IJ12, IJ24, between the ink inlet advantage of ink ♦ May result in IJ27, IJ29, IJ30 and the nozzle filtration complex construction chamber. The filter ♦ Ink filter may be has a multitude of fabricated with no small holes or slots, additional process restricting ink flow. steps The filter also removes particles which may block the nozzle. Small inlet The ink inlet channel ♦ Design simplicity ♦ Restricts refill rate ♦ IJ02, IJ37, IJ44 compared to the nozzle chamber ♦ May result in a to nozzle has a substantially relatively large chip smaller cross section area than that of the nozzle, ♦ Only partially resulting in easier ink effective egress out of the nozzle than out of the inlet. Inlet shutter A secondary actuator ♦ Increases speed ♦ Requires separate ♦ IJ09 controls the position of of the ink jet print refill actuator and a shutter, closing off the head operation drive circuit ink inlet when the main actuator is energized. The inlet is The method avoids the ♦ Back-flow problem ♦ Requires careful ♦ IJ01, IJ03, IJ05, located problem of inlet back- is eliminated design to minimize IJ06, IJ07, IJ10, behind the flow by arranging the the negative pressure IJ11, IJ14, IJ16, ink-pushing ink-pushing surface of behind the paddle IJ22, IJ23, IJ25, surface the actuator between 1128, IJ31, IJ32, the inlet and the IJ33, IJ34, IJ35, nozzle. IJ36, IJ39, IJ40, IJ41 Part of the The actuator and a ♦ Significant ♦ Small increase in ♦ IJ07, IJ20, IJ26, actuator wall of the ink reductions in back- fabrication complexity IJ38 moves to chamber are arranged flow can be shut off the so that the motion of achieved inlet the actuator closes off ♦ Compact designs the inlet. possible Nozzle In some configurations ♦ Ink back-flow ♦ None related to ♦ Silverbrook, EP actuator of ink jet, there is no problem is ink back-flow on 0771 658 A2 and does not expansion or movement eliminated actuation related patent result in ink of an actuator which applications back-flow may cause ink back-flow ♦ Valve-jet through the inlet. ♦ Tone-jet

NOZZLE CLEARING METHOD Description Advantages Disadvantages Examples Normal All of the nozzles are ♦ No added ♦ May not be ♦ Most ink jet nozzle firing fired periodically, complexity on the sufficient to systems before the ink has a print head displace dried ink ♦ IJ01, IJ02, IJ03, chance to dry. When IJ04, IJ05, IJ06, not in use the nozzles IJ07, IJ09, IJ10, are sealed (capped) IJ11, IJ12, IJ14, against air. IJ16, IJ20, IJ22, The nozzle firing is IJ23, IJ24, IJ25, usually performed IJ26, IJ27, IJ28, during a special IJ29, IJ30, IJ31, clearing cycle, after IJ32, IJ33, IJ34, first moving the print IJ36, IJ37, IJ38, head to a cleaning IJ39, IJ40, IJ41, station. IJ42, IJ43, IJ44, IJ45 Extra In systems which heat ♦ Can be highly ♦ Requires higher ♦ Silverbrook, EP power to the ink, but do not boil effective if the drive voltage for 0771 658 A2 and ink heater it under normal heater is adjacent to clearing related patent situations, nozzle the nozzle ♦ May require applications clearing can be larger drive achieved by over- transistors powering the heater and boiling ink at the nozzle. Rapid The actuator is fired in ♦ Does not require ♦ Effectiveness ♦ May be used succession rapid succession. In extra drive circuits depends with: IJ01, IJ02, of actuator some configurations, on the print head substantially upon IJ03, IJ04, IJ05, pulses this may cause heat ♦ Can be readily the configuration of IJ06, IJ07, IJ09, build-up at the nozzle controlled and the ink jet nozzle IJ10, IJ11, IJ14, which boils the ink, initiated by digital IJ16, IJ20, IJ22, clearing the nozzle. In logic IJ23, IJ24, IJ25, other situations, it may IJ27, IJ28, IJ29, cause sufficient IJ30, IJ31, IJ32, vibrations to dislodge IJ33, IJ34, IJ36, clogged nozzles. IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44, IJ45 Extra Where an actuator is ♦ A simple ♦ Not suitable ♦ May be used power to not normally driven to solution where where there is a with: IJ03, IJ09, ink pushing the limit of its motion, applicable hard limit to IJ16, IJ20, IJ23, actuator nozzle clearing may be actuator movement IJ24, IJ25, IJ27, assisted by providing IJ29, IJ30, IJ31, an enhanced drive IJ32, IJ39, IJ40, signal to the actuator. IJ41, IJ42, IJ43, IJ44, IJ45 Acoustic An ultrasonic wave is ♦ A high nozzle ♦ High ♦ IJ08, IJ13, IJ15, resonance applied to the ink clearing capability implementation cost IJ17, IJ18, IJ19, chamber. This wave is can be achieved if system does not IJ21 of an appropriate ♦ May be already include an amplitude and implemented at very acoustic actuator frequency to cause low cost in systems sufficient force at the which already nozzle to clear include acoustic blockages. This is actuators easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity. Nozzle A microfabricated ♦ Can clear ♦ Accurate mechanical ♦ Silverbrook, EP clearing plate is pushed against severely clogged alignment is required 0771 658 A2 and plate the nozzles. The plate nozzles ♦ Moving parts are related patent has a post for every required applications nozzle. A post moves ♦ There is risk of through each nozzle, damage to the nozzles displacing dried ink. ♦ Accurate fabrication is required Ink The pressure of the ink ♦ May be effective ♦ Requires ♦ May be used pressure is temporarily where other pressure pump or with all IJ series ink pulse increased so that ink methods cannot be other pressure jets streams from all of the used actuator nozzles. This may be ♦ Expensive used in conjunction ♦ Wasteful of ink with actuator energizing. Print head A flexible ‘blade’ is ♦ Effective for ♦ Difficult to use if ♦ Many ink jet wiper wiped across the print planar print head print head surface is systems head surface. The surfaces non-planar or very blade is usually ♦ Low cost fragile fabricated from a ♦ Requires flexible polymer, e.g. mechanical parts rubber or synthetic ♦ Blade can wear elastomer. out in high volume print systems Separate A separate heater is ♦ Can be effective ♦ Fabrication ♦ Can be used with ink boiling provided at the nozzle where other nozzle complexity many IJ series ink heater although the normal clearing methods jets drop e-ection cannot be used mechanism does not ♦ Can be require it. The heaters implemented at no do not require additional cost in individual drive some ink jet circuits, as many configurations nozzles can be cleared simultaneously, and no imaging is required.

NOZZLE PLATE CONSTRUCTION Description Advantages Disadvantages Examples Electro- A nozzle plate is ♦ Fabrication ♦ High ♦ Hewlett Packard formed separately fabricated simplicity temperatures and Thermal Ink jet nickel from electroformed pressures are nickel, and bonded to required to bond the print head chip. nozzle plate ♦ Minimum thickness constraints ♦ Differential thermal expansion Laser Individual nozzle ♦ No masks ♦ Each hole must ♦ Canon Bubblejet ablated or holes are ablated by an required be individually ♦ 1988 Sercel et al., drilled intense UV laser in a ♦ Can be quite fast formed SPIE, Vol. 998 polymer nozzle plate, which is ♦ Some control ♦ Special Excimer Beam typically a polymer over nozzle profile equipment required Applications, pp. such as polyimide or is possible ♦ Slow where there 76-83 polysulphone ♦ Equipment are many thousands ♦ 1993 Watanabe required is relatively of nozzles per print et al., U.S. Pat. No. low cost head 5,208,604 ♦ May produce thin burrs at exit holes Silicon A separate nozzle ♦ High accuracy is ♦ Two part ♦ K. Bean, IEEE micro- plate is attainable construction Transactions on machined micromachined from ♦ High cost Electron Devices, single crystal silicon, ♦ Requires Vol. ED-25, No. 10, and bonded to the precision alignment 1978, pp 1185-1195 print head wafer. ♦ Nozzles may be ♦ Xerox 1990 clogged by adhesive Hawkins et al., U.S. Pat. No. 4,899,181 Glass Fine glass capillaries ♦ No expensive ♦ Very small ♦ 1970 Zoltan U.S. capillaries are drawn from glass equipment required nozzle sizes are Pat. No. 3,683,212 tubing. This method ♦ Simple to make difficult to form has been used for single nozzles ♦ Not suited for making individual mass production nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. Monolithic, The nozzle plate is ♦ High accuracy ♦ Requires ♦ Silverbrook, EP surface deposited as a layer (<1 μm) sacrificial layer 0771 658 A2 and micro- using standard VLSI ♦ Monolithic under the nozzle related patent machined deposition techniques. ♦ Low cost plate to form the applications using VLSI Nozzles are etched in ♦ Existing nozzle chamber ♦ IJ01, IJ02, IJ04, litho- the nozzle plate using processes can be ♦ Surface may be IJ11, IJ12, IJ17, graphic VLSI lithography and used fragile to the touch IJ18, IJ20, IJ22, processes etching. IJ24, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Monolithic, The nozzle plate is a ♦ High accuracy ♦ Requires long ♦ IJ03, IJ05, IJ06, etched buried etch stop in the (<1 μm) etch times IJ07, IJ08, IJ09, through wafer. Nozzle chambers ♦ Monolithic ♦ Requires a IJ10, IJ13, IJ14, substrate are etched in the front ♦ Low cost support wafer IJ15, IJ16, IJ19, of the wafer, and the ♦ No differential IJ21, IJ23, IJ25, wafer is thinned from expansion IJ26 the back side. Nozzles are then etched in the etch stop layer. No nozzle Various methods have ♦ No nozzles to ♦ Difficult to ♦ Ricoh 1995 plate been tried to eliminate become clogged control drop Sekiya et al U.S. the nozzles entirely, to position accurately Pat. No. 5,412,413 prevent nozzle clogging. ♦ Crosstalk ♦ 1993 Hadimioglu These include thermal problems et al EUP 550,192 bubble mechanisms and ♦ 1993 Elrod et al and acoustic lens EUP 572,220 mechanisms Trough Each drop ejector has a ♦ Reduced ♦ Drop firing ♦ IJ35 trough through which manufacturing direction is sensitive a paddle moves. There complexity to wicking. is no nozzle plate. ♦ Monolithic Nozzle slit The elimination of ♦ No nozzles to ♦ Difficult to ♦ 1989 Saito et al instead of nozzle holes and become clogged control drop U.S. Pat. No. individual replacement by a slit position accurately 4,799,068 nozzles encompassing many ♦ Crosstalk actuator positions problems reduces nozzle clogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages Examples Edge Ink flow is along the ♦ Simple ♦ Nozzles limited ♦ Canon Bubblejet (‘edge surface of the chip, construction to edge 1979 Endo et al GB shooter’) and ink drops are ♦ No silicon ♦ High resolution patent 2,007,162 ejected from the chip etching required is difficult ♦ Xerox heater-in- edge. ♦ Good heat ♦ Fast color pit 1990 Hawkins et al sinking via substrate printing requires U.S. Pat. No. 4,899,181 ♦ Mechanically one print head per ♦ Tone-jet strong color ♦ Ease of chip handing Surface Ink flow is along the ♦ No bulk silicon ♦ Maximum ink ♦ Hewlett-Packard (‘roof surface of the chip, etching required flow is severely TIJ 1982 Vaught et al shooter’) and ink drops are ♦ Silicon can make restricted U.S. Pat. No. 4,490,728 ejected from the chip an effective heat ♦ IJ02, IJ11, IJ12, surface, normal to the sink IJ20, IJ22 plane of the chip. ♦ Mechanical strength Through Ink flow is through the ♦ High ink flow ♦ Requires bulk ♦ Silverbrook, EP chip, chip, and ink drops are ♦ Suitable for silicon etching 0771 658 A2 and forward ejected from the front pagewidth print related patent (‘up surface of the chip. heads applications shooter’) ♦ High nozzle ♦ IJ04, IJ17, IJ18, packing density IJ24, IJ27-IJ45 therefore low manufacturing cost Through Ink flow is through the ♦ High ink flow ♦ Requires wafer ♦ IJ01, IJ03, IJ05, chip, chip, and ink drops are ♦ Suitable for thinning IJ06, IJ07, IJ08, reverse ejected from the rear pagewidth print ♦ Requires special IJ09, IJ10, IJ13, (‘down surface of the chip. heads handling during IJ14, IJ15, IJ16, shooter’) ♦ High nozzle manufacture IJ19, IJ21, IJ23, packing density IJ25, IJ26 therefore low manufacturing cost Through Ink flow is through the ♦ Suitable for ♦ Pagewidth print ♦ Epson Stylus actuator actuator, which is not piezoelectric print heads require ♦ Tektronix hot fabricated as part of heads several thousand melt piezoelectric the same substrate as connections to drive ink jets the drive transistors. circuits ♦ Cannot be manufactured in standard CMOS fabs ♦ Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Water based ink which ♦ Environmentally ♦ Slow drying ♦ Most existing ink dye typically contains: friendly ♦ Corrosive jets water, dye, surfactant, ♦ No odor ♦ Bleeds on paper ♦ All IJ series ink humectant, and ♦ May jets biocide. strikethrough ♦ Silverbrook, EP Modern ink dyes have ♦ Cockles paper 0771 658 A2 and high water-fastness, related patent light fastness applications Aqueous, Water based ink which ♦ Environmentally ♦ Slow drying ♦ IJ02, IJ04, IJ21, pigment typically contains: friendly ♦ Corrosive IJ26, IJ27, IJ30 water, pigment, ♦ No odor ♦ Pigment may ♦ Silverbrook, EP surfactant, humectant, ♦ Reduced bleed clog nozzles 0771 658 A2 and and biocide. ♦ Reduced wicking ♦ Pigment may related patent Pigments have an ♦ Reduced clog actuator applications advantage in reduced strikethrough mechanisms ♦ Piezoelectric ink- bleed, wicking and ♦ Cockles paper jets strikethrough. ♦ Thermal ink jets (with significant restrictions) Methyl MEK is a highly ♦ Very fast dyeing ♦ Odorous ♦ All IJ series ink Ethyl volatile solvent used ♦ Prints on various ♦ Flammable jets Ketone for industrial printing substrates such as (MEK) on difficult surfaces metals and plastics such as aluminum cans. Alcohol Alcohol based inks ♦ Fast drying ♦ Slight odor ♦ All IJ series ink (ethanol, 2- can be used where the ♦ Operates at sub- ♦ Flammable jets butanol, printer must operate at freezing and others) temperatures below temperatures the freezing point of ♦ Reduced paper water. An example of cockle this is in-camera ♦ Low cost consumer photo- graphic printing. Phase The ink is solid at ♦ No drying time - ♦ High viscosity ♦ Tektronix hot change room temperature, and ink instantly freezes ♦ Printed ink melt piezoelectric (hot melt) is melted in the print on the print medium typically has a ink jets head before jetting. ♦ Almost any print ‘waxy’ feel ♦ 1989 Nowak U.S. Hot melt inks are medium can be used ♦ Printed pages Pat. No. 4,820,346 usually wax based, ♦ No paper cockle may ‘block’ ♦ All IJ series ink with a melting point occurs ♦ Ink temperature jets around 80° C. After ♦ No wicking may be above the jetting the ink freezes occurs curie point of almost instantly upon ♦ No bleed occurs permanent magnets contacting the print ♦ No strikethrough ♦ Ink heaters medium or a transfer occurs consume power roller. ♦ Long warm-up time Oil Oil based inks are ♦ High solubility ♦ High viscosity: ♦ All IJ series ink extensively used in medium for some this is a significant jets offset printing. They dyes limitation for use in have advantages in ♦ Does not cockle ink jets, which improved paper usually require a characteristics on ♦ Does not wick low viscosity. Some paper (especially no through paper short chain and wicking or cockle). multi-branched oils Oil soluble dies and have a sufficiently pigments are required. low viscosity. ♦ Slow drying Micro- A microemulsion is a ♦ Stops ink bleed. ♦ Viscosity higher ♦ All IJ series ink emulsion stable, self forming ♦ High dye than water jets emulsion of oil, water, solubility ♦ Cost is slightly and surfactant. The ♦ Water, oil, and higher than water characteristic drop size anaphiphilic soluble based ink is less than 100 nm, dies can be used ♦ High surfactant and is determined by ♦ Can stabilize concentration the preferred curvature pigment required (around of the surfactant. suspensions 5%) 

What is claimed is:
 1. A nozzle arrangement for an ink jet printhead comprising: a nozzle chamber having an ink ejection port for ejecting ink from the nozzle chamber; an ink supply reservoir for supplying ink to the nozzle chamber; a magnetic actuator located between the nozzle chamber and the ink supply reservoir which is configured to be actuated by externally supplied magnetic pulse cycles to eject ink from the ejection port; and a blocking mechanism for blocking movement of the magnetic actuator when ink is not to be ejected from the ink ejection port during one of the magnetic pulse cycles.
 2. A nozzle arrangement as claimed in claim 1 wherein the blocking mechanism comprises a thermal actuator having a moveable end portion which is moveable to a position blocking the path of movement of the magnetic actuator.
 3. A nozzle arrangement as claimed in claim 1 wherein the magnetic actuator includes an end protuberance designed to engage the blocking mechanism upon movement of the actuator.
 4. A nozzle arrangement as claimed in claim 1 wherein the magnetic actuator is affixed to an adjacent wall of the nozzle chamber by means of two bendable strip portions which allow bending movement of the magnetic actuator upon activation by the externally supplied magnetic pulse cycles.
 5. A nozzle arrangement as claimed in claim 1 the thermal actuator comprises substantially two arms affixed to a substrate, a first arm having a thin serpentine structure encased in a material having a high coefficient of thermal expansion and a second arm comprising a thicker arm having a tapered thin portion near the end connecting to the substrate so as to concentrate any bending of the actuator at a point close to the substrate.
 6. A nozzle arrangement as claimed in claim 5 wherein the blocking mechanism is located in a cavity having a low degree of fluid flow through the cavity and the serpentine arm is located alongside an inner wall of the cavity.
 7. A nozzle arrangement as claimed in claim 1 wherein the blocking mechanism is located in a cavity having a low degree of fluid flow through the cavity.
 8. A nozzle arrangement as claimed in claim 1 which is constructed using semiconductor fabrication techniques.
 9. A nozzle arrangement as claimed in claim 1 wherein portions of the thermal actuator and the magnetic actuator include a silicon nitride covering as required so as to insulate and passivate them from adjacent portions.
 10. A nozzle arrangement as claimed in claim 1 wherein the nozzle chamber is formed from high density low pressure plasma etching of a silicon substrate. 